BUSINESS

FC-BGA / CSP Bump Height measurement using WSI measurement technology

WSI (white light scanning interferometer) measurement technology is a method that measures the length of an object by the difference between the signal reflected from the object and the signal reflected from the reference surface. QFP/SOP is developing into products using surface mount technology using solder balls such as BGA/CSP according to the development of the electronic device industry.

LAONPEOPLE applied WSI measurement technology which has the advantages of the simple optical system and fast inspection speed to measure the height of the solder ball, which has over 1,000 pins, the basis of future package technology.

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FC-BGA / CSP Bump Height measurement using WSI measurement technology Information
FC-BGA / CSP Bump Height measurement using WSI measurement technology




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LAONPEOPLE overcome the disadvantages of WSI measurement technology which
has narrow FOV by expanding the WSI measurement area to 35mm x 35mm for one-time.

Applied split measurement technology to measure a large bump area



Applied Divided measurement technology to measure products whose bump area exceeds 35mm x 35mm,
and 70mm x 70mm of bump area can be measured when measuring up to 4 divisions.