LAON PEOPLE

  
                                    (LPMC-4MPM)                                                                                                                         (LPMC-CIF1-A)                                                                                       (LPMC-CIF2-S)  

Introduction of Products

Unlike traditional product configurations, LAON PEOPLE's LPMC-4MPM & LPMC-CIF# incorporates all the functions of receiving and analyzing output image signals from camera modules, organizing image data, and processing various images into the PC (main board, LPMC-4MPM). This minimizes the size of the camera module interface (interface board, LPMC-CIF#), heat generation, and vibration caused by the non-installment of FAN. These advantages have made it freer from issues such as size, heat and vibration when applied to inspection equipment​.

The LPMC-4MPM product supports four camera modules and can greatly reduce PC CPU share by accessing PC memory directly through high speed DMA. As a result, various problems (such as poor reception of images, reduced video frame speed, and the issue of Tack time due to increased PC CPU share) can be solved depending on PC specifications or performance of existing commercial LAN cards. As it supports four camera modules at the same time, it is cost-effective and is easy to apply because only the interface board (LPMC-CIF#) should be applied in case of changing/expanding the camera module configuration to one channel, two channels, three channels, and four channels depending on equipment configuration and inspection purposes. In addition, the product stability was enhanced by providing status LED (or LCD) display function for motion and product diagnostic software, and it is possible to secure the integrity of image data through the CRC function for MIPI data. The addition of AI inspection features can improve accuracy in inspection for defect, stain, and quality​.​  

Features

• ​Camera module interface : MIPI C/D PHY (V1.2)
• Supporting multi-camera module : 4 C/D PHY COMBO
• Sensor programming interface : IIC, SPI (Reduce the camera module initialization time with support for various functions including Burst Read/Write (reduce the tack time by 2 to 3 times))
• FPGA internalized features provide faster frame processing, lower CPU load - (1) Reduce the tack time and provide higher image data throughput / (2) Provide special benefits for AF, OIS, and Active Align
• Offer alternatives to PC CPU share issues caused by high-resolution image transfer- reduce PC CPU share by accessing the PC memory directly with DMA method
• Simplify equipment structure - small size, no fan use (no vibration and heating issues)
•         Check error and secure data integrity - (1) Data integrity: secure the integrity through CRC function on MIPI data (2) Check error: Provide the LED (or LCD) showing status of Grabber and SW diagnosing Grabber; (3) Provide the S/W of checking socket board performance (function of comparing deviation by socket board)
•         Origin of AI inspection function: AI Stain, AI Foreign Body, Image Quality

• ​ Inspect camera modules and components of portable devices such as smartphones and tablets (lens, IR filters, AF actuator, inspection equipment, etc.)​​

Introduction of Product

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Features

• ​Camera module interface: Support the DisplayPort V1.3 (HBR3), 1CH camera module
• Sensor programming interface: IIC, SPI (Reduce the camera module initialization time with support for various functions including Burst Read/Write (reduce the tack time by 2 to 3 times))
• FPGA internalized features provide faster frame processing, lower CPU load - (1) Reduce the tack time and provide higher image data throughput / (2) Provide special benefits for AF, OIS, and Active Align
• Offer alternatives to PC CPU share issues caused by high-resolution image transfer- reduce PC CPU share by accessing the PC memory directly with DMA method
• Simplify equipment structure - minimize in-instrument installation restrictions with smaller size
• Check error and secure data integrity - Data integrity: secure the integrity through CRC function on image data - Check error: (1) Provide the LED (or LCD) showing status of Grabber and SW diagnosing Grabber; (2) Provide the S/W of checking socket board performance (function of comparing deviation by socket board)
• Origin of AI inspection function: AI Stain, AI Foreign Body, Image Quality

Future Value or Applicable Area

• ​Inspect camera modules and components of portable devices such as smartphones and tablets (lens, IR filters, AF actuator, inspection equipment, etc.)​

Introduction of Products​

Quadruple 10GigE PCIE Reception Card​ 

10GigE Common Commercial LANCARDs have a problem with high PC CPU shares. This may result in a problem where the test S/W is not working properly or the Tack Time is prolonged. The product developed to solve this problem is LPRX-410G. This product can dramatically reduce PC CPU share by storing image data directly in PC memory, regardless of PC CPU.

Feature​

• Supporting the Quadruole 10GigE high-speed Interface and 8 Lane PCI Express
• Providing the fast control interface for reducing the program initialization time
  
• Maximizing the S/W interworking to reduce equipment development time
  
• Providing the driver that supports various PC OSs

Introduction of Products ​

Camera Module Inspection Solution Supporting Single Camera Module + the Single 10GigE 

​

It uses one port of 10GigE and provides high bandwidth of approximately over 9Gbps. Also, C/D-Phy signals can receive about 2Gsps/2Gbps per lane.

It supports both D-Phy and C-Phy, so you can inspect any combination of camera modules.

Because it's made up of small sizes, there are many advantages to equipment configuration.

Feature​

• High-pixel camera module inspection using Single 10GigE high-speed interface
• Cross supporting of MPI D-Phy and C-Phy
  
• Built-in ISP that reduces the tact time and increase accuracy
  
• Reducing the Tack Time by transferring necessary areas with Multi-ROI function
  
• Providing the fast control interface for reducing the program initialization time
  
• Supporting the inspection for the electrical characteristics at the level of measuring instrument
  
• Maximizing the S/W interworking to reduce equipment development time
  

Introduction of Products​

Camera Module Inspection Solution Supporting Quadruple Camera Module + Quadruple 10GigE

​

It supports both D-Phy and C-Phy, so you can inspect any combination of camera modules.

The four camera modules can be inspected at the same time, making them the most productive, and equipment configuration.

Feature​

• High-pixel camera module inspection using Quadruple 10GigE high-speed interface
  
• Cross supporting of MPI D-Phy and C-Phy​
• Built-in ISP that reduces the tact time and increase accuracy​
• Reducing the Tack Time by transferring necessary areas with Multi-ROI function​
• Providing the fast control interface for reducing the program initialization time​
• Supporting the inspection for the electrical characteristics at the level of measuring instrument​
• Maximizing the S/W interworking to reduce equipment development time​

 Future Value or Applicable Area​

• ​Inspection of camera modules and parts (lens, IR filters, AF actuators, inspection equipment, etc.) on portable devices such as smart phones and tablets​​

  

Introduction of Products 

Camera Module Inspection Solution Supporting Dual Camera Module + the Dual 10GigE 

Feature​

• ​High-pixel camera module inspection using dual USB 3.0 interface​
• Cross-use of MIPI D-Phy and C-Phy​
• Built-in ISP that reduce tact time and increase accuracy​
• Reducing the Tack Time by transferring necessary areas with Multi-ROI function​
• Providing the fast control interface for reducing the program initialization time​
• Supporting the inspection for the electrical characteristics at the level of measuring instrument​
• Maximizing the S/W interworking to reduce equipment development time​

Future Value or Applicable Area

• ​ Inspection of camera modules and parts (lens, IR filters, AF actuators, inspection equipment, etc.) on portable devices such as smart phones and tablets

Introduction of Products     

Feature

• High-pixel camera module inspection using dual USB 3.0 interface
• Cross-use of MIPI D-Phy and C-Phy
• Built-in ISP that reduce tact time and increase accuracy
• Reducing the Tack Time by transferring necessary areas with Multi-ROI function
• Providing the fast control interface for reducing the program initialization time
• Supporting the inspection for the electrical characteristics at the level of measuring instrument
• Maximizing the S/W interworking to reduce equipment development time

Future Value or Applicable Area

• Inspection of camera modules and parts (lens, IR filters, AF actuators, inspection equipment, etc.) on portable devices such as smart phones and tablets

Introduction of Products 

Feature

• Supporting the MIPI D-Phy
• Built-in ISPs that reduce Tact Time and increase accuracy
• Reducing the Tack Time by transferring necessary areas with Multi-ROI function
• Providing the fast control interface for reducing the program initialization time
• Supporting the inspection for the electrical characteristics at the level of measuring instrument
• Maximizing the S/W interworking to reduce equipment development time

Future Value or Applicable Area

• Inspection of camera modules and parts (lens, IR filters, AF actuators, inspection equipment, etc.) on portable devices such as smart phones and tablets.
• Vehicle camera module inspection